AMD Refreshes Ryzen AI, Adds 9850X3D at CES 2026

AMD Refreshes Ryzen AI, Adds 9850X3D at CES 2026

AMD’s CES 2026 showing centers on modest refreshes rather than big architectural leaps, headlined by new Ryzen AI 400 mobile chips and a faster X3D gaming CPU.

> At a Glance

> – Ryzen AI 300 mobile series becomes 400 series with small speed bumps

> – Ryzen 7 9850X3D desktop CPU debuts at 5.6 GHz, ~7% quicker than the 9900X3D

> – Ryzen AI Max Plus 392/388 add 40-CU graphics for cheaper AI/gaming notebooks

> – Why it matters: Gamers and creators get slightly faster parts without new architectures this cycle

AMD labels this cycle a “tween” update: necessary tweaks rather than generational jumps.

Mobile Gets the Ryzen AI 400 Series

The stack keeps Zen 5 cores but nudges clocks and NPU throughput:

Model Cores (Zen 5/5c) Max Boost NPU GPU CUs GPU MHz
Ryzen AI 9 HX 475 8/4 5.2 GHz 60 TOPS 16 (890M) 3.1
Ryzen AI 9 HX 470 8/4 5.2 GHz 55 TOPS 16 (890M) 3.1
Ryzen AI 9 465 6/4 5.0 GHz 50 TOPS 12 (880M) 2.9
Ryzen AI 7 450 4/4 5.1 GHz 50 TOPS 8 (860M) 3.1

Non-HX models also gain support for slightly faster memory.

Desktop Boost: Ryzen 7 9850X3D

Using higher-binned dies, the 9850X3D pushes frequency to 5.6 GHz-a 100 MHz gain AMD says yields around 7% extra performance over the 9900X3D.

GPU-Heavy Ryzen AI Max Plus

Two new laptop processors-392 and 388-replace their non-Plus siblings by upping integrated graphics from 32 to 40 compute units (branded 8090S) while keeping CPU specs intact. The change targets gamers and local-AI workloads at a lower price than the flagship Ryzen AI Max Plus 395.

Ryzen AI Halo Dev Box

AMD also unveiled a compact desktop aimed at developers:

  • Ships with a Ryzen AI Max processor
  • 128 GB of shared memory
  • Supports multiple operating systems
  • Pre-loaded open-source tools plus AMD’s ROCm AI stack

Key Takeaways

mobile
  • No new microarchitecture-just refined bins and higher clocks
  • Ryzen AI 400 mobile chips top out at 60 TOPS NPU, 5.2 GHz boost
  • 9850X3D becomes fastest gaming X3D CPU, albeit marginally
  • AI Max Plus 392/388 offer 40-CU graphics for mid-tier laptops
  • Halo box gives devs a ready-made local-AI workstation

Expect these parts to hit shelves through early 2026 as AMD saves bigger leaps for future nodes.

Author

  • My name is Amanda S. Bennett, and I am a Los Angeles–based journalist covering local news and breaking developments that directly impact our communities.

    Amanda S. Bennett covers housing and urban development for News of Los Angeles, reporting on how policy, density, and displacement shape LA neighborhoods. A Cal State Long Beach journalism grad, she’s known for data-driven investigations grounded in on-the-street reporting.

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